HPE Xeon Intel -Gold 6354 3.0GHz 18-core 205W Processor for
- Brand: HPE
- Category:
- SKU: P36935-B21
- EAN: 0190017502953
HPE Xeon Intel -Gold 6354 3.0GHz 18-core 205W Processor for, Intel® Xeon® Gold, LGA 4189, 10 nm, Tray, Intel, 3 GHz
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
INT XEON-G 6354 CPU FOR HPE |
455C2W |
Description
HPE Xeon Intel -Gold 6354 3.0GHz 18-core 205W Processor for. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Width: 15" (381 mm), Depth: 19.3" (489 mm), Height: 11.5" (292.1 mm)
Specifications
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Processor socket | LGA 4189 |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor model | 6354 |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor codename | Ice Lake |
| Processor boost frequency | 3.6 GHz |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Features | |
| Execute Disable Bit | Yes |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Technical details | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Width | 15" (381 mm) |
| Depth | 19.3" (489 mm) |
| Height | 11.5" (292.1 mm) |
| Weight | 24 oz (680 g) |
| Other features | |
| Maximum internal memory | 6 TB |
