Intel ® Q170 Chipset

Intel ® Q170 Chipset

Intel ® Q170 Chipset, 22 nm, Desktop, Industrial Commercial Temp, PC/Client/Tablet, Embedded Broad Market Commercial Temp, 23 x 23 mm, 8 GT/s, 6 W

Trade Prices

Distributor Product SKU Stock Updated Price
Synnex

GL82Q170 PLATFORM CONTROLLER HUB

6012200 Register free see stock

Description

Intel ® Q170 Chipset. Lithography: 22 nm, Market segment: Desktop, Use conditions: Industrial Commercial Temp, PC/Client/Tablet, Embedded Broad Market Commercial Temp. USB version: 2.0/3.2 Gen 1 (3.1 Gen 1). Export Control Classification Number (ECCN): 5A992.C, Commodity Classification Automated Tracking System (CCATS): G147881. Launch date: Q3'15, Product codename: Skylake, Status: Launched

Specifications

Features
Thermal Design Power (TDP)6 W
Embedded options availableYes
Supports overclockingNo
Supported RAID configurationPCIe 0,1,5 / SATA 0,1,5,10
StatusLaunched
Bus speed8 GT/s
Number of displays supported3
System bus rate8 GT/s
ECCNo
On-board graphics cardNo
Lithography22 nm
Market segmentDesktop
Use conditionsIndustrial Commercial Temp, PC/Client/Tablet, Embedded Broad Market Commercial Temp
Package size23 x 23 mm
Launch dateQ3'15
Product codenameSkylake
PCI SupportNo
Product seriesIntel® 100 Series Desktop Chipsets
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)5A992.C
Commodity Classification Automated Tracking System (CCATS)G147881
USB 3.2 Gen 1 (3.1 Gen 1) ports quantity10
USB 2.0 ports quantity14
USB ports quantity14
Processor special features
Intel® Smart Sound TechnologyYes
Intel® Smart Response TechnologyYes
Intel® Platform Trust Technology (Intel® PTT)Yes
Intel® Optane™ Memory ReadyNo
Intel® High Definition Audio (Intel® HD Audio)Yes
Intel® Boot GuardYes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel Trusted Execution TechnologyYes
Intel Standard ManageabilityYes
Intel Stable Image Platform Program (SIPP)Yes
Intel Rapid Storage Technology enterpriseNo
Intel Rapid Storage TechnologyYes
Intel ME Firmware Version11
Intel® vPro™ Platform EligibilityYes
Intel® Rapid Storage Technology for PCI StorageYes
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) ports quantity10
USB 2.0 ports quantity14
USB ports quantity14
Number of SATA III connectors6
Maximum number of PCI Express lanes20
PCI Express slots version3.0
USB version2.0/3.2 Gen 1 (3.1 Gen 1)
Brand-specific features
Intel® Smart Sound TechnologyYes
Intel® Smart Response TechnologyYes
Intel® Platform Trust Technology (Intel® PTT)Yes
Intel® Optane™ Memory ReadyNo
Intel® High Definition Audio (Intel® HD Audio)Yes
Intel® Boot GuardYes
Intel® vPro™ Platform EligibilityYes
Expansion slots
Maximum number of PCI Express lanes20
PCI Express slots version3.0
PCI SupportNo
Logistics data
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)5A992.C
Commodity Classification Automated Tracking System (CCATS)G147881