StarTech.com HEATGREASE20 heat sink compound 1.066 W/m·K 0.847 oz (24 g)
- Brand: StarTech.com
- Category:
- SKU: HEATGREASE20
- EAN: 0065030844826 7038556932004 50 ...6932004 5054629277829 4923123136509 0650308448266 0112840007139 5554442356188 7038556931991 5054484390176 7038556931984 5054533390171 5706998944672 0801201083584more
StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks - heat grease - cpu paste - thermal compound
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
20G TUBE CPU THERMAL PASTE |
55558Q | |||
|
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone |
4755348 |
Description
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
The StarTech.com Advantage
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
The StarTech.com Advantage
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics
Specifications
| Features | |
|---|---|
| Storage temperature (T-T) | -50 - 100 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Thermal resistance | 0.195 °C/W |
| Thermal conductivity | 1.066 W/m·K |
| Operating temperature (T-T) | -20 - 100 °C |
| Product colour | White |
| Specific gravity | 2.3 g/cm³ |
| Technical details | |
| Evaporation (@ 200°C/24h) | 0.001% |
| Bleed (@ 200°C/24h) | 0.005% |
| Compliance certificates | RoHS |
| Storage temperature (T-T) | -50 - 100 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Thermal resistance | 0.195 °C/W |
| Thermal conductivity | 1.066 W/m·K |
| Operating temperature (T-T) | -20 - 100 °C |
| Weight & dimensions | |
| Width | 2.83" (72 mm) |
| Depth | 0.709" (18 mm) |
| Height | 0.709" (18 mm) |
| Weight | 0.847 oz (24 g) |
| Package width | 3.31" (84 mm) |
| Package depth | 5.98" (152 mm) |
| Package height | 0.906" (23 mm) |
| Package weight | 1.31 oz (37 g) |
| Packaging data | |
| Package width | 3.31" (84 mm) |
| Package depth | 5.98" (152 mm) |
| Package height | 0.906" (23 mm) |
| Package weight | 1.31 oz (37 g) |
| Operational conditions | |
| Storage temperature (T-T) | -50 - 100 °C |
| Operating temperature (T-T) | -20 - 100 °C |
| Colour | |
| Product colour | White |
